Type DIP, 0.3" (7.62mm) Row Spacing  
Number of Positions or Pins (Grid) 8 (2 x 4)  
Pitch - Mating 0.100" (2.54mm)  
Contact Finish - Mating Gold  
Contact Finish Thickness - Mating Flash  
Contact Material - Mating Beryllium Copper  
Mounting Type Through Hole  
Features Open Frame  
Termination Solder  
Pitch - Post 0.100" (2.54mm)  
Contact Finish - Post Gold  
Contact Finish Thickness - Post Flash  
Contact Material - Post Copper  
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester  
Operating Temperature -55°C ~ 105°C  
Termination Post Length 0.125" (3.18mm)  
Material Flammability Rating UL94 V-0  
Contact Resistance 10 mOhm

 

5 PCs IC Socket 8 PIN PCB Solder Type DIP ROUND HOLE Socket 8p 8-pin DIP-8 8DIP

SKU: 808-AG11D-ESL-LF
$2.99Price